Electrovac
Trademark details
Electrovac® is a registered trademark used for Plastics Additives, In Particular Polymer Bonded Nanofiber Master Batches and Compounds For Reinforcement In Composite Materials For Mechanical, Electrical and Thermal Use and owned by Electrovac AG. Full trade mark registration details, registered images and more information below.
| Goods and/or Services: | Plastics Additives, In Particular Polymer Bonded Nanofiber Master Batches and Compounds For Reinforcement In Composite Materials For Mechanical, Electrical and Thermal Use Thermally Conducting Adhesives Also In the Form of Pastes Electrically Conducting Pastes Nanofiber Reinforced Composites. In Particular Reinforced Epoxy Resins the Foregoing All For Use In Manufacturing In the Automotive, Aerospace, Medical, Electronics Industry For Environmental Technology and For Major Appliances Metal Matrix Composite Materials and Metal-Ceramic Composite Materials For Use In Manufacturing In the Electronic Industry Machined Parts, Namely, Moulds Made of Plastics and Carbon Such As Graphite, Carbon Fibers, Carbon Nanofibers and Graphitic Nanofibers, the Moulds For Use In the Manufacture of Thermoplastic. Duroplastic Materials Injected By High Pressure or By Application of Vacuum Temperature Controllers, Temperature Controllers With Bimetal Disks, Temperature Controllers With Expansion Rods Thermal Cut-Outs, Thermal Cut-Out Switches With Bimetal Disks, Thermal Cut-Outs With Expansion Rods, All Foregoing For Use In the Electronics, Automotive, Aerospace and Semiconductor Industry: Temperature Sensors, Oxygen Sensors, Electronic Control and Evaluation Units For the Operation and Signal Evaluation of Oxygen Sensors, Oxygen Measurement Apparatus, Sensors For Monitoring Liquid Level, Temperature and Air Flow, Thermal Cut-Out Switches, Temperature Fuses All Foregoing For Use In the Electronics, Automotive, Aerospace and Semiconductor Industry Components For Electronic and Electrical Module Units and Their Parts For Use In the Computer Industry Namely, Water Coolers and Water Cooling Systems With Pumps Heat-Pipes and Heat-Spreaders Components Formed With Glass Bushings For Electronic and Electrical Module Units and Their Parts For Use In the Computer Industry, Namely, Transistor Headers, Battery Covers, Housings For Semiconductor Chips Including Connecting Leads, Pins or Balls, Large Scale Feed-Throughs, Saw Filters, Metal Packages, Quartz-Holders Housings Made of Metal For Electronic and Electrical Module Units and Their Parts Hybrid-Housings. Namely Hybrid Housings Made of Metal and Ceramic, Namely, Opto Electronic Packages. Lens Caps, High Frequency Housings For Opto-Electronic Packages, Automotive Electronics, Frequency Controls Housings Made of Metal With Glass Bushings In Particular For Electronic and Electrical Module Units and Their Parts For Use With Computers Housings Made of Metal For Optoelectronic Components Coolers With Liquid Cooling Agent For Module Units In the Electronic and Electrical Industry Electronic and Electrical Components, Electronic and Electrical Apparatus and Their Parts, In Particular Micro-Channel Coolers For Microprocessors High Performance Coolers and Coolers For Personal Computer Housings Coolers For Laser Diodes, Control Units For Ceramic Surface Cook Tops For Cooking Appliances Transistor Headers, Namely Housings For Semiconductor Chips Including Connecting Leads, Pins or Balls, So-Called Packages Covers For Electric Batteries In Particular Made of Steel or Special Steel Sensor Housings Igniter Headers, Namely, Airbag Pyrolytic Charge Igniter Headers Thermally Conducting Interface Materials For the Thermal Coupling of Components In the Electrical and Electronic Field, Namely, Metal Matrix Composites, Heat Sinks or Heat Spreaders, Thermal Grease, Thermal Paste, Thermal Resins Field Emission Cathodes, Heat Sinks and Heat Straddlers, Namely, Heat Sinks For Use In Power Electronic Modules, Heat Sinks For Use In Microprocessors, Heat Sinks For Use In Power Chips Such As Light Emitting Diodes or Lasers, All For Use In the Electronics Field Circuit Boards, In Particular Ceramic Circuit Boards Semiconductor Chip Housings Made of Copper Coated Ceramic, In Particular Made of Copper Coated Aluminum Oxide Ceramic or Aluminum Nitride Ceramic For Use In the Electronics Field. Copper Coated Aluminum Oxide (A1203) For Use In Integrated Circuits Substrates For Use In Integrated Circuits Copper Coated Aluminum Nitride (Ain) For Use In Integrated Circuits Thermally Conducting Foils and Pads For Commercial Use In Electronic Components Use In Integrated Circuits Substrates In the Nature of Copper-Ceramic Alloys In the Form of Insulating Components and Insulating Materials Provided With Current Conductors Electrical Insulators, Namely, Glass Bushings, In Particular Pre-Stressed Glass Bushings and Tuned Glass Bushings For Use In Integrated Circuits Carbon Nanofibers Not For Textile Use Graphitic Nanofibers Not For Textile Use Nanofibers Reinforced Composite Material, In Particular Exopy Resin Material For Industrial and Commercial Use Thermally Conducting Adhesive Tapes, Foils and Pads For Industrial and Commercial Use |
| Serial Number: | 78811229 |
| Filing Date: | Feb 9, 2006 |
|
Last Applicant(s)/ Owner(s) of Record | Electrovac AGAufeldgasse 37-39 |
| Related Products: | Chemicals, Metal Goods, Machinery, Electrical and Scientific Apparatus, Rubber Goods |
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